Invention Application
US20160092351A1 MEMORY MODULE HAVING DIFFERENT TYPES OF MEMORY MOUNTED TOGETHER THEREON, AND INFORMATION PROCESSING DEVICE HAVING MEMORY MODULE MOUNTED THEREIN
有权
具有与之相关的不同类型的存储器的存储器模块以及具有安装的存储器模块的信息处理装置
- Patent Title: MEMORY MODULE HAVING DIFFERENT TYPES OF MEMORY MOUNTED TOGETHER THEREON, AND INFORMATION PROCESSING DEVICE HAVING MEMORY MODULE MOUNTED THEREIN
- Patent Title (中): 具有与之相关的不同类型的存储器的存储器模块以及具有安装的存储器模块的信息处理装置
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Application No.: US14764838Application Date: 2013-06-20
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Publication No.: US20160092351A1Publication Date: 2016-03-31
- Inventor: Yutaka UEMATSU , Satoshi MURAOKA , Hiroshi KAKITA , Akio IDEI , Yusuke FUKUMURA , Satoru WATANABE , Takayuki ONO , Taishi SUMIKURA , Yuichi FUKUDA , Takashi MIYAGAWA , Michinori NAITO , Hideki OSAKA , Masabumi SHIBATA , Hitoshi UENO , Kazunori NAKAJIMA , Yoshihiro KONDO
- Applicant: HITACHI, LTD.
- International Application: PCT/JP2013/067003 WO 20130620
- Main IPC: G06F12/02
- IPC: G06F12/02 ; G11C16/04 ; G11C7/10
Abstract:
A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.
Public/Granted literature
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