Invention Application
- Patent Title: THERMAL SIMULATIONS USING CONVOLUTION AND ITERATIVE METHODS
- Patent Title (中): 使用变换和迭代方法的热模拟
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Application No.: US14502752Application Date: 2014-09-30
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Publication No.: US20160092616A1Publication Date: 2016-03-31
- Inventor: Ryan Michael Coutts , Arpit Mittal , Rajat Mittal , Mohamed Waleed Allam , Mehdi Saeidi
- Applicant: QUALCOMM Incorporated
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F17/15
Abstract:
Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.
Information query
