Invention Application
- Patent Title: INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
-
Application No.: US14499222Application Date: 2014-09-28
-
Publication No.: US20160093552A1Publication Date: 2016-03-31
- Inventor: Archana Venugopal , Marie Denison , Luigi Colombo , Hiep Nguyen , Darvin Edwards
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L23/498
Abstract:
A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
Public/Granted literature
- US09496198B2 Integration of backside heat spreader for thermal management Public/Granted day:2016-11-15
Information query
IPC分类:
