Invention Application
- Patent Title: CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE
- Patent Title (中): 电路板包括散热结构
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Application No.: US14870741Application Date: 2015-09-30
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Publication No.: US20160095198A1Publication Date: 2016-03-31
- Inventor: Tae Hong MIN , Myung Sam KANG , Young Gwan KO , Min Jae SEONG
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2014-0131228 20140930
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/11
Abstract:
Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.
Public/Granted literature
- US09699885B2 Circuit board including heat dissipation structure Public/Granted day:2017-07-04
Information query
