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公开(公告)号：US20210399408A1
公开(公告)日：2021-12-23
申请号：US17068304
申请日：2020-10-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN
Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes: a first substrate portion having a rigid region and a flexible region; and a second substrate portion disposed on the first substrate portion. The first substrate portion and the second substrate portion are disposed to be shifted such that portions of each of the first substrate portion and the second substrate portion overlap each other.
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公开(公告)号：US20160021755A1
公开(公告)日：2016-01-21
申请号：US14801076
申请日：2015-07-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jung Han LEE , Tae Hong MIN , Yul Kyo CHUNG , Young Gwan KO , Myung Sam KANG
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2224/16235 , H01L2224/16265 , H05K1/0231 , H05K3/3436 , H05K3/4644 , H05K2201/10015
Abstract: The present invention relates to a chip embedded substrate, which includes a substrate formed by alternately stacking an insulation layer and a circuit layer and an embedded chip equipped with a connection terminal and mounted inside the substrate, wherein the connection terminal is protruded from the insulation layer placed on the outermost layer of the substrate, and a connection surface to be connected to an electronic component is exposed to the outside.
Abstract translation: 芯片嵌入式基板技术领域本发明涉及一种芯片嵌入式基板，其包括通过交替堆叠绝缘层和电路层而形成的基板和配备有连接端子的嵌入式芯片，其安装在基板内部，其中，连接端子从绝缘层突出 放置在基板的最外层，并且要连接到电子部件的连接表面暴露于外部。
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公开(公告)号：US20240365467A1
公开(公告)日：2024-10-31
申请号：US18407677
申请日：2024-01-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Jong Eun PARK
CPC classification number: H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/115 , H05K3/46 , H05K2201/096 , H05K2201/09827
Abstract: The present disclosure relates to a printed circuit board include: a core layer including an inorganic insulating layer, a resin layer covering at least a portion of an external side surface of the inorganic insulating layer, and a second insulating layer covering at least a portion of a lower surface of each of the inorganic insulating layer and the resin layer and having an interlayer boundary with the resin layer; a first wiring layer disposed on an upper surface of the core layer; and a second wiring layer disposed on a lower surface of the core layer. The external side surface of the inorganic insulating layer is substantially perpendicular to at least one of the upper surface and the lower surface of the inorganic insulating, and a manufacturing method therefor.
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公开(公告)号：US20170330674A1
公开(公告)日：2017-11-16
申请号：US15395075
申请日：2016-12-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sa Yong LEE , Myung Sam KANG , Tae Hong MIN , Seon Ha KANG , Mi Sun HWANG , Il Jong SEO
CPC classification number: H01F27/255 , H01F5/00 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F41/046 , H01F41/10 , H01F41/122 , H01F2017/048 , H01F2027/2809
Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.
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5.发明申请ELECTRONIC COMPONENT PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE INCLUDING THE SAME 审中-公开电子元件封装和包装包装结构公开(公告)号：US20160336296A1
公开(公告)日：2016-11-17
申请号：US15151885
申请日：2016-05-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Won JEONG , Young Gwan KO , Myung Sam KANG , Tae Hong MIN
IPC: H01L25/065 , H01L23/538 , H01L23/31 , H01L23/498 , H01L23/367
CPC classification number: H01L23/5389 , H01L21/568 , H01L23/13 , H01L23/16 , H01L23/3128 , H01L23/36 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/49894 , H01L23/5383 , H01L23/5384 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1436 , H01L2924/1438 , H01L2924/145 , H01L2924/15311 , H01L2924/15321 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511
Abstract: An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.
Abstract translation: 电子部件封装包括：包含金属或陶瓷基材料并具有通孔的框架，设置在通孔中的电子部件，至少覆盖框架和电子部件的上部的绝缘部，接合部 至少部分地设置在所述框架和所述绝缘部件之间，以及重新配置部分，其布置在所述框架和所述电子部件的一侧。
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Patent Agency Ranking
公开(公告)号：US20150373841A1
公开(公告)日：2015-12-24
申请号：US14746308
申请日：2015-06-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Yong Sam LEE , Tae Hong MIN , Young Gwan KO , Yoong OH , Joon Sung LEE
CPC classification number: H05K3/4605 , C03B33/074 , H05K1/0306 , H05K2201/09036 , H05K2201/09827 , Y10T83/0207 , Y10T428/24488
Abstract: A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer.
Abstract translation: 根据一个实施例的印刷电路板包括：具有形成在其侧表面上的斜面图案的芯; 层叠在所述芯上的第一绝缘层; 层叠在所述第一绝缘层上以覆盖所述芯的侧表面的第二绝缘层; 分别形成在所述第一绝缘层和所述第二绝缘层上的内电路层和外电路层; 以及层叠在第二绝缘层上的阻焊层。
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7.发明申请PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURING METHOD THEREOF 审中-公开印刷电路板，印刷电路板条及其制造方法公开(公告)号：US20150319852A1
公开(公告)日：2015-11-05
申请号：US14470011
申请日：2014-08-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Yi Hyun JUNG , Suk Hyeon CHO , Young Gwan KO
CPC classification number: C03C15/02 , H01L2224/16227 , H01L2224/81192 , H01L2224/97 , H01L2924/15311 , H01L2924/15788 , H01L2924/3511 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/142 , H05K3/002 , H05K3/0029 , H05K3/0044 , H05K3/0052 , H05K3/42 , H05K3/4605 , H05K2201/09136 , H05K2201/09154 , H05K2201/09536 , H05K2203/1509 , H05K2203/1518 , H01L2224/81
Abstract: A printed circuit board and a manufacturing method thereof. According to one embodiment, a printed circuit board may include a core part; and a conductor pattern disposed on at least one surface of the core part, the core part includes a glass core having a side portion that is polished or thinner than a central portion of the core. According to another embodiment, a method of manufacturing the printed circuit board may include cutting a glass plate to form a glass core; and removing cracks from at least one side surface of the cut glass core.
Abstract translation: 印刷电路板及其制造方法。 根据一个实施例，印刷电路板可以包括芯部分; 以及设置在所述芯部的至少一个表面上的导体图案，所述芯部包括玻璃芯，所述玻璃芯具有被抛光或比所述芯的中心部更薄的侧部。 根据另一实施例，制造印刷电路板的方法可以包括切割玻璃板以形成玻璃芯; 并且从切割的玻璃芯的至少一个侧表面去除裂纹。
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公开(公告)号：US20220095449A1
公开(公告)日：2022-03-24
申请号：US17124893
申请日：2020-12-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Jung BYUN , Jung Soo KIM , Sang Hyun SIM , Chang Min HA , Tae Hong MIN , Jin Won LEE
IPC: H05K1/02
Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
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公开(公告)号：US20160095202A1
公开(公告)日：2016-03-31
申请号：US14870192
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Young Gwan KO , Jung Han LEE , Myung Sam KANG
CPC classification number: H05K3/445 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/81444 , H01L2924/00014 , H05K1/0271 , H05K3/429 , H05K3/4608 , H05K2201/09581 , H05K2203/0392 , H01L2924/014 , H01L2224/45099
Abstract: A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved.
Abstract translation: 电路板包括具有穿过第一金属层的上表面的第一通孔及其下表面的第一金属层; 设置在所述第一通孔的表面上的电镀部; 设置在电镀部的表面的绝缘膜; 以及通过向由绝缘膜的外表面包围的区域的至少一部分提供导电材料而形成的第一通孔。 由于电路板可以实现第一通孔的细度，同时形成第一金属层比现有技术更厚，因此翘曲可能降低，并且可以提高散热性能。
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公开(公告)号：US20160095201A1
公开(公告)日：2016-03-31
申请号：US14849880
申请日：2015-09-10
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Myung Sam KANG , Jin Hyuk JANG , Young Gwan KO
CPC classification number: H05K1/0204 , H01L21/4882 , H01L23/3677 , H01L23/373 , H01L23/49827 , H01L23/5389 , H01L2224/16235 , H01L2224/16265 , H01L2924/15311 , H05K1/0206 , H05K1/0207 , H05K2201/0323
Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.
Abstract translation: 电路板包括包括石墨或石墨烯的第一传热结构，其中第一传热结构的至少一部分设置在绝缘构件的内部，底漆层设置在第一传热结构的表面上。 第一传热结构可以包括多个单体，所述单体包括设置在至少一层石墨或石墨烯的至少一个表面上的底漆层。
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