Invention Application
- Patent Title: TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS
- Patent Title (中): 电子电路纺织整合
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Application No.: US14752576Application Date: 2015-06-26
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Publication No.: US20160100480A1Publication Date: 2016-04-07
- Inventor: Bjorn Van Keymeulen , Frederick Bossuyt , Thomas Vervust
- Applicant: IMEC vzw
- Applicant Address: BE Leuven BE Gent
- Assignee: IMEC vzw,Universiteit Gent
- Current Assignee: IMEC vzw,Universiteit Gent
- Current Assignee Address: BE Leuven BE Gent
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/00 ; H05K3/46 ; H05K1/02 ; H05K3/32

Abstract:
The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.
Public/Granted literature
- US10149381B2 Textile integration of electronic circuits Public/Granted day:2018-12-04
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