Invention Application
- Patent Title: Electronic Module and Method for Producing an Electronic Module
- Patent Title (中): 电子模块及其制造方法
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Application No.: US14880532Application Date: 2015-10-12
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Publication No.: US20160104631A1Publication Date: 2016-04-14
- Inventor: Karsten Guth , Guido Strotmann
- Applicant: Infineon Technologies AG
- Priority: DE102014114808.8 20141013
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/06 ; H01L23/053
Abstract:
One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.
Public/Granted literature
- US09768035B2 Electronic module and method for producing an electronic module Public/Granted day:2017-09-19
Information query
IPC分类:
