公开(公告)号：US09768035B2

公开(公告)日：2017-09-19

申请号：US14880532

申请日：2015-10-12

Applicant: Infineon Technologies AG

Inventor： Karsten Guth ,  Guido Strotmann

IPC: H05K7/00 ,  H01L21/48 ,  H01L23/053 ,  H01L23/498 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L21/4817 ,  H01L21/4889 ,  H01L23/053 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40101 ,  H01L2224/40105 ,  H01L2224/40157 ,  H01L2224/40227 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/014

Abstract: One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.

公开(公告)号：US20160104631A1

公开(公告)日：2016-04-14

申请号：US14880532

申请日：2015-10-12

Applicant: Infineon Technologies AG

Inventor： Karsten Guth ,  Guido Strotmann

IPC: H01L21/48 ,  H01L23/06 ,  H01L23/053

CPC classification number: H01L21/4817 ,  H01L21/4889 ,  H01L23/053 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40101 ,  H01L2224/40105 ,  H01L2224/40157 ,  H01L2224/40227 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/8546 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/014

Abstract: One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.

Abstract translation: 本发明的一个方面涉及一种包括模块壳体和导电连接元件的电子模块。 连接元件具有第一部分和第二部分，以及在第一部分和第二部分之间的轴。 在轴的区域中设置有非金属涂层的连接元件与涂层一起在轴的区域中被注入到模块壳体中，使得连接元件固定在模块壳体中。

公开(公告)号：US20230411254A1

公开(公告)日：2023-12-21

申请号：US17845280

申请日：2022-06-21

Applicant: Infineon Technologies AG

Inventor： Ivan Nikitin ,  Christian Neugirg ,  Karsten Guth ,  Gerald Ofner

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/49 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49562 ,  H01L23/3107 ,  H01L23/49 ,  H01L23/4952 ,  H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565

Abstract: A molded power semiconductor package includes power semiconductor dies embedded in a mold compound and a lead frame embedded in the mold compound above the power semiconductor dies. A first part of the lead frame includes branches electrically connected to a first load terminal of the power semiconductor dies. A second part of the lead frame is spaced inward from the branches of the first part, and electrically connected to a gate terminal of the power semiconductor dies. The first part of the lead frame has a protrusion that juts out from a first side face of the mold compound to form a first lead of the molded package. A longitudinal axis of the second part of the lead frame intersects the first lead. The second part of the lead frame is physically disconnected from the first lead by a severed region of the lead frame.