Invention Application
- Patent Title: SOLID SUPPORT INCLUDING A POLYMER AND USE THEREOF
- Patent Title (中): 固体支持，包括聚合物及其用途
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Application No.: US14884548Application Date: 2015-10-15
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Publication No.: US20160107141A1Publication Date: 2016-04-21
- Inventor: Myoungsoon Kim , Gahee Kim , Youngwan Ha
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0139066 20141015
- Main IPC: B01J20/286
- IPC: B01J20/286 ; G01N33/545 ; B01J20/26
Abstract:
A solid support with a polymer, and a method of using the solid support are provided.
Information query
