Invention Application
- Patent Title: METHOD OF DISTRIBUTING CURRENT IN ELECTRODEPOSITION PROCESS
- Patent Title (中): 电沉积过程中分布电流的方法
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Application No.: US14977243Application Date: 2015-12-21
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Publication No.: US20160108543A1Publication Date: 2016-04-21
- Inventor: Sammy Lee Adkisson , Samuel Adam Adkisson , John Bougneit , Dale Lee Hughes
- Applicant: S & J TECHNOLOGIES, LLC
- Main IPC: C25D17/12
- IPC: C25D17/12

Abstract:
A method is provided for electrodepositing a coating a conductive workpiece. The method provides for individually switching on or off electrodes both interior to and exterior to the workpiece so as to control the deposition of the coating material on the interior surface and the exterior surface of the workpiece. Further, an electrode having insulating positioners can be utilized to provide for better centering of the electrode in the interior of the workpiece.
Public/Granted literature
- US09587323B2 Electrodeposition electrode for use in the interior of a pipe Public/Granted day:2017-03-07
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