Provided is a thermoelectric module apparatus including: a pipe-shaped housing having a hole that is longitudinally formed; a thermoelectric module coupled to the housing; and heat sinks combined with the thermoelectric module, in which the pipe-shaped housing has a plurality of mount holes having predetermined width and length, longitudinally extending, and arranged circumferentially in parallel with each other, the thermoelectric module has a plurality of thermoelectric plates having predetermined width, length, and thickness, the housing is connected to first sides in the width direction of the thermoelectric plates, the thermoelectric plates are disposed in the mount holes respectively with a portion in the width direction inserted and exposed inside the hole as much as a predetermined width and a portion in the width direction protruding and exposed outside the housing as much as a predetermined width, and the heat sinks are connected to the portions exposed outside the housing.