THERMOELECTRIC MODULE APPARATUS
    1.
    发明申请
    THERMOELECTRIC MODULE APPARATUS 有权
    热电模块设备

    公开(公告)号:US20160111623A1

    公开(公告)日:2016-04-21

    申请号:US14852694

    申请日:2015-09-14

    IPC分类号: H01L35/32 H01L35/30

    CPC分类号: H01L35/32 H01L35/30

    摘要: Provided is a thermoelectric module apparatus including: a pipe-shaped housing having a hole that is longitudinally formed; a thermoelectric module coupled to the housing; and heat sinks combined with the thermoelectric module, in which the pipe-shaped housing has a plurality of mount holes having predetermined width and length, longitudinally extending, and arranged circumferentially in parallel with each other, the thermoelectric module has a plurality of thermoelectric plates having predetermined width, length, and thickness, the housing is connected to first sides in the width direction of the thermoelectric plates, the thermoelectric plates are disposed in the mount holes respectively with a portion in the width direction inserted and exposed inside the hole as much as a predetermined width and a portion in the width direction protruding and exposed outside the housing as much as a predetermined width, and the heat sinks are connected to the portions exposed outside the housing.

    摘要翻译: 本发明提供一种热电模块装置,包括:管状壳体,其具有纵向形成的孔; 耦合到所述壳体的热电模块; 和与热电模块组合的散热器,其中管状壳体具有多个具有预定宽度和长度的安装孔,纵向延伸并彼此平行地布置,热电模块具有多个热电板,其具有 预定的宽度,长度和厚度,壳体连接到热电板的宽度方向上的第一侧,热电板分别设置在安装孔中,宽度方向上的一部分插入并暴露在孔内,多达 预定宽度和宽度方向上的部分突出并暴露在壳体外部多达预定宽度,并且散热器连接到暴露在壳体外部的部分。