Invention Application
US20160113357A1 METHOD OF FORMING SOLE AND SOLE STRUCTURE WITH SHOE NAIL COUPLED THERETO AND SOLE STRUCTURE WITH SHOE NAIL 审中-公开
用鞋钉联结的鞋钉和鞋底结构形成鞋底和鞋底结构的方法

  • Patent Title: METHOD OF FORMING SOLE AND SOLE STRUCTURE WITH SHOE NAIL COUPLED THERETO AND SOLE STRUCTURE WITH SHOE NAIL
  • Patent Title (中): 用鞋钉联结的鞋钉和鞋底结构形成鞋底和鞋底结构的方法
  • Application No.: US14522588
    Application Date: 2014-10-24
  • Publication No.: US20160113357A1
    Publication Date: 2016-04-28
  • Inventor: Teng-Jen YANG
  • Applicant: Teng-Jen YANG
  • Main IPC: A43D69/00
  • IPC: A43D69/00 A43B13/28
METHOD OF FORMING SOLE AND SOLE STRUCTURE WITH SHOE NAIL COUPLED THERETO AND SOLE STRUCTURE WITH SHOE NAIL
Abstract:
A method of forming a sole and a sole structure with shoe nails coupled thereto and the sole structure with the shoe nails are provided. The method includes pre-forming shoe nails, putting the shoe nails in an injection molding mold, injecting a thermally molten sole material into a mold in a manner that the sole material covers inner and outer surfaces of the shoe nails, and performing a cooling process whereby the sole material solidifies and turns into a sole which is then coupled to the shoe nails. The method enables a sole with shoe nails to be quickly manufactured so easily that it increases production efficiency and economic benefits.
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