Invention Application
US20160115360A1 BASE POLYMER FOR HOT-MELT ADHESIVE AGENT, AND HOT-MELT ADHESIVE AGENT
有权
用于热熔胶粘剂的基础聚合物和热熔胶粘剂
- Patent Title: BASE POLYMER FOR HOT-MELT ADHESIVE AGENT, AND HOT-MELT ADHESIVE AGENT
- Patent Title (中): 用于热熔胶粘剂的基础聚合物和热熔胶粘剂
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Application No.: US14894152Application Date: 2014-05-27
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Publication No.: US20160115360A1Publication Date: 2016-04-28
- Inventor: Kazuhiro HASHIMA , Tomoaki TAKEBE , Yutaka MINAMI , Masao INOUE , Kenji KOBAYASHI
- Applicant: IDEMITSU KOSAN CO., LTD.
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP2013-111323 20130527
- International Application: PCT/JP2014/064019 WO 20140527
- Main IPC: C09J123/12
- IPC: C09J123/12 ; A61L15/58 ; A61L15/24 ; C09J5/00
Abstract:
Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.
Public/Granted literature
- US09725626B2 Base polymer for hot-melt adhesive agent, and hot-melt adhesive agent Public/Granted day:2017-08-08
Information query
IPC分类:
