Abstract:
Provided are an adhesive composition which has high adhesive strength and holding strength and leaves no residual glue by using a polyolefinic polymer, and an adhesive tape using the same. The adhesive composition contains (1) 5 to 95% by mass of a polyolefin having a melting point which is lower than 20° C. or is not observed by a differential scanning calorimeter (DSC) and having a ΔH of less than 5 J/g, and (2) 5 to 95% by mass of a polyolefin having a melting point of 20° C. or higher and 160° C. or lower and having a ΔH of 5 J/g or more and 100 J/g or less, wherein the storage elastic modulus of the composition at 25° C. obtained from the solid viscoelasticity measurement of the composition is 1 MPa or more and 200 MPa or less, and the storage elastic modulus thereof at 50° C. is 1 MPa or more and 100 MPa or less.
Abstract:
Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.
Abstract:
Provided are a propylene-based polymer which enhances heat creep resistance and a hot-melt adhesive having excellent heat creep resistance. A propylene-based polymer which satisfies the following (1) and (2): (1) 125≦a modulus of elasticity in tension (MPa) at 23° C.≦400; and (2) 100≦an elongation at break (%) at 23° C.≦1,000, and a hot-melt adhesive containing the propylene-based polymer in an amount of 1 to 50% by mass.