ADHESIVE COMPOSITION AND ADHESIVE TAPE USING SAME
    1.
    发明申请
    ADHESIVE COMPOSITION AND ADHESIVE TAPE USING SAME 审中-公开
    胶粘组合物和粘合胶带使用相同

    公开(公告)号:US20150299527A1

    公开(公告)日:2015-10-22

    申请号:US14439765

    申请日:2013-10-31

    Abstract: Provided are an adhesive composition which has high adhesive strength and holding strength and leaves no residual glue by using a polyolefinic polymer, and an adhesive tape using the same. The adhesive composition contains (1) 5 to 95% by mass of a polyolefin having a melting point which is lower than 20° C. or is not observed by a differential scanning calorimeter (DSC) and having a ΔH of less than 5 J/g, and (2) 5 to 95% by mass of a polyolefin having a melting point of 20° C. or higher and 160° C. or lower and having a ΔH of 5 J/g or more and 100 J/g or less, wherein the storage elastic modulus of the composition at 25° C. obtained from the solid viscoelasticity measurement of the composition is 1 MPa or more and 200 MPa or less, and the storage elastic modulus thereof at 50° C. is 1 MPa or more and 100 MPa or less.

    Abstract translation: 提供一种具有高粘合强度和保持强度并且通过使用聚烯烃聚合物不留下残留胶的粘合剂组合物,以及使用其的胶带。 粘合剂组合物含有(1)5〜95质量%的熔点低于20℃的聚烯烃或差示扫描量热计(DSC)未观察到并且具有小于5的&Dgr; H J / g和(2)5〜95质量%的熔点为20℃以上且160℃以下且具有5J / g以上且100以上的Dgr的H的聚烯烃 J / g以下,其中,由组合物的固体粘弹性测定得到的组合物在25℃下的储能弹性模量为1MPa以上且200MPa以下,其储存弹性模量为50℃ 为1MPa以上且100MPa以下。

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