Invention Application
- Patent Title: DEVICE AND METHOD FOR VACUUM EVAPORATING
- Patent Title (中): 真空蒸发的装置和方法
-
Application No.: US14726257Application Date: 2015-05-29
-
Publication No.: US20160115583A1Publication Date: 2016-04-28
- Inventor: JI-HO UH , Jun-Sung Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2014-0146286 20141027
- Main IPC: C23C14/24
- IPC: C23C14/24 ; C23C14/54

Abstract:
A device for vacuum evaporating includes a thermal evaporation module that generates vapor in a vacuum chamber through a circular opening by heating a vapor evaporation material accommodated therein. A moving stage is positioned in an atmospheric area separated from the vacuum chamber and adjusts a position of the thermal evaporation module under the thermal evaporation module. A sealing part is combined with the thermal evaporation module to isolate the vacuum chamber and the atmospheric area from each other and maintain a vacuum state of the vacuum chamber while surrounding the thermal evaporation module and permitting movement of the thermal evaporation module.
Information query
IPC分类: