Invention Application
- Patent Title: COATED PHOTOCONDUCTIVE SUBSTRATE
- Patent Title (中): 涂层光电基板
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Application No.: US14888362Application Date: 2013-07-31
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Publication No.: US20160116852A1Publication Date: 2016-04-28
- Inventor: Michael H. Lee , Krzysztof Nauka , Sivapackia Ganapathiappan , Omer Gila
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- International Application: PCT/US13/52850 WO 20130731
- Main IPC: G03G15/00
- IPC: G03G15/00 ; B05D5/12

Abstract:
The present disclosure is drawn to apparatuses and methods that include a coated photoconductive substrate. The coated photoconductive substrate can include a photoconductive substrate with a charge generation layer and a charge transport layer, and can also have a coating adhered to the photoconductive substrate. The coating can have a thickness ranging from 1 nm to 200 nm.
Public/Granted literature
- US09823592B2 Coated photoconductive substrate Public/Granted day:2017-11-21
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