Invention Application
US20160118075A1 LASER SUBASSEMBLY METALLIZATION FOR HEAT ASSISTED MAGNETIC RECORDING
审中-公开
用于热辅助磁记录的激光分层金属化
- Patent Title: LASER SUBASSEMBLY METALLIZATION FOR HEAT ASSISTED MAGNETIC RECORDING
- Patent Title (中): 用于热辅助磁记录的激光分层金属化
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Application No.: US14987083Application Date: 2016-01-04
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Publication No.: US20160118075A1Publication Date: 2016-04-28
- Inventor: Jon Paul Hurley , Bernard W. Bell , Steven Harlow Anderson Axdal
- Applicant: Seagate Technology LLC
- Main IPC: G11B7/127
- IPC: G11B7/127 ; G11B5/60 ; C22C5/02 ; C22C13/00 ; B23K35/26 ; B23K35/30

Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Public/Granted literature
- US09536556B2 Laser subassembly metallization for heat assisted magnetic recording Public/Granted day:2017-01-03
Information query
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