Invention Application
US20160118217A1 E-BEAM INSPECTION APPARATUS AND METHOD OF USING THE SAME ON VARIOUS INTEGRATED CIRCUIT CHIPS
有权
电子束检查装置及其在各种集成电路卡上的使用方法
- Patent Title: E-BEAM INSPECTION APPARATUS AND METHOD OF USING THE SAME ON VARIOUS INTEGRATED CIRCUIT CHIPS
- Patent Title (中): 电子束检查装置及其在各种集成电路卡上的使用方法
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Application No.: US14989729Application Date: 2016-01-06
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Publication No.: US20160118217A1Publication Date: 2016-04-28
- Inventor: Indranil De , Christopher Hess , Dennis J. Ciplickas
- Applicant: PDF Solutions, Inc.
- Main IPC: H01J37/22
- IPC: H01J37/22 ; H01J37/20 ; H01J37/147 ; H01J37/285
Abstract:
The present invention discloses an e-beam inspection tool, and an apparatus for detecting defects. In one aspect is described an apparatus for detecting defects that includes a focusing column that accelerates the e-beam and separately, for each of the plurality of predetermined locations, focuses the e-beam to a predetermined non-circular spot that is within the predetermined surface area of each of the plurality of predetermined locations based upon the major axis,
Public/Granted literature
- US09793090B2 E-beam inspection apparatus and method of using the same on various integrated circuit chips Public/Granted day:2017-10-17
Information query
