Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS
- Patent Title (中): 基板加工设备
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Application No.: US14923524Application Date: 2015-10-27
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Publication No.: US20160121373A1Publication Date: 2016-05-05
- Inventor: Junya Minamida , Daisuke Aoki
- Applicant: Tokyo Electron Limited
- Priority: JP2014-223256 20141031
- Main IPC: B08B5/02
- IPC: B08B5/02

Abstract:
Particles can be suppressed from adhering to a substrate. A substrate processing apparatus includes a carry-in/out chamber, a transfer chamber, and a delivery chamber. In the carry-in/out chamber, the substrate is carried in and out with respect to a carrier, and in the transfer chamber, a transfer path for the substrate toward a substrate processing chamber, where a predetermined process is performed on the substrate, is formed. Further, the delivery chamber is arranged between the carry-in/out chamber and the transfer chamber. Moreover, an internal pressure of the delivery chamber is higher than an internal pressure of the carry-in/out chamber and an internal pressure of the transfer chamber.
Public/Granted literature
- US10186433B2 Substrate processing apparatus Public/Granted day:2019-01-22
Information query
IPC分类: