Invention Application
US20160121373A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
基板加工设备

  • Patent Title: SUBSTRATE PROCESSING APPARATUS
  • Patent Title (中): 基板加工设备
  • Application No.: US14923524
    Application Date: 2015-10-27
  • Publication No.: US20160121373A1
    Publication Date: 2016-05-05
  • Inventor: Junya MinamidaDaisuke Aoki
  • Applicant: Tokyo Electron Limited
  • Priority: JP2014-223256 20141031
  • Main IPC: B08B5/02
  • IPC: B08B5/02
SUBSTRATE PROCESSING APPARATUS
Abstract:
Particles can be suppressed from adhering to a substrate. A substrate processing apparatus includes a carry-in/out chamber, a transfer chamber, and a delivery chamber. In the carry-in/out chamber, the substrate is carried in and out with respect to a carrier, and in the transfer chamber, a transfer path for the substrate toward a substrate processing chamber, where a predetermined process is performed on the substrate, is formed. Further, the delivery chamber is arranged between the carry-in/out chamber and the transfer chamber. Moreover, an internal pressure of the delivery chamber is higher than an internal pressure of the carry-in/out chamber and an internal pressure of the transfer chamber.
Public/Granted literature
Information query
Patent Agency Ranking
0/0