Invention Application
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14993671Application Date: 2016-01-12
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Publication No.: US20160126345A1Publication Date: 2016-05-05
- Inventor: Tomohiro TAMAKI , Yoshito Nakazawa , Satoshi Eguchi
- Applicant: Renesas Electronics Corporation
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Priority: JP2009-263600 20091119
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/40 ; H01L29/10

Abstract:
A semiconductor device which solves the following problem of a super junction structure: due to a relatively high concentration in the body cell region (active region), in peripheral areas (peripheral regions or junction end regions), it is difficult to achieve a breakdown voltage equivalent to or higher than in the cell region through a conventional junction edge terminal structure or resurf structure. The semiconductor device includes a power MOSFET having a super junction structure formed in the cell region by a trench fill technique. Also, super junction structures having orientations parallel to the sides of the cell region are provided in a drift region around the cell region.
Public/Granted literature
- US09660070B2 Power superjunction MOSFET device with resurf regions Public/Granted day:2017-05-23
Information query
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