Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
- Patent Title (中): 多层电子元件
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Application No.: US14866840Application Date: 2015-09-25
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Publication No.: US20160126918A1Publication Date: 2016-05-05
- Inventor: Young Ghyu AHN , Min Cheol PARK , Byoung Hwa LEE , Dong Hwan LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0151921 20141104
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01G4/06 ; H01F27/40 ; H01F27/24 ; H01F27/28 ; H01G4/30 ; H01G4/005

Abstract:
A multilayer electronic component includes a body including a dielectric layer and/or a magnetic layer, a terminal part including an input terminal, an output terminal, and a ground terminal connected to the body, and a filter part including a coil part disposed in the body and a capacitor part connected to the coil part and filtering a high frequency component of an input signal input to the input terminal. The capacitor part includes a plurality of first internal electrodes connected to the coil part and a plurality of second internal electrodes exposed to an exterior of the body.
Public/Granted literature
- US09948263B2 Multilayer electronic component Public/Granted day:2018-04-17
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