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    COIL COMPONENT
    1.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20240234013A9

    公开(公告)日：2024-07-11

    申请号：US18242092

    申请日：2023-09-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun KIM ,  Dong Hwan LEE ,  Dong Jin LEE ,  Byeong Cheol MOON ,  Boum Seock KIM

    IPC: H01F27/29 ,  H01F17/00

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/0066

    Abstract: A coil component includes a body, a supporting member disposed in the body and including one surface and the other surface opposing the one surface in a first direction, a first coil including a first winding portion disposed on one surface of the supporting member, a second coil including a second winding portion disposed on the other surface of the supporting member, a first external electrode and a second external electrode connected to one end and the other end of the first coil, respectively, a third external electrode and a fourth external electrode connected to one end and the other end of the second coil, respectively, and a first connection electrode and a second connection electrode disposed on the other surface side of the supporting member and connecting one end and the other end of the first coil to the first and second external electrodes, respectively.

    COIL COMPONENT
    2.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20240136111A1

    公开(公告)日：2024-04-25

    申请号：US18242092

    申请日：2023-09-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun KIM ,  Dong Hwan LEE ,  Dong Jin LEE ,  Byeong Cheol MOON ,  Boum Seock KIM

    IPC: H01F27/29 ,  H01F17/00

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/0066

    Abstract: A coil component includes a body, a supporting member disposed in the body and including one surface and the other surface opposing the one surface in a first direction, a first coil including a first winding portion disposed on one surface of the supporting member, a second coil including a second winding portion disposed on the other surface of the supporting member, a first external electrode and a second external electrode connected to one end and the other end of the first coil, respectively, a third external electrode and a fourth external electrode connected to one end and the other end of the second coil, respectively, and a first connection electrode and a second connection electrode disposed on the other surface side of the supporting member and connecting one end and the other end of the first coil to the first and second external electrodes, respectively.

    COIL COMPONENT
    3.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20230395298A1

    公开(公告)日：2023-12-07

    申请号：US18095162

    申请日：2023-01-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Hwan LEE ,  Chan YOON ,  Dong Jin LEE ,  Jung Hyuk JUNG

    IPC: H01F17/00 ,  H01F27/29 ,  H01F27/00 ,  H01F17/04

    CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F27/292 ,  H01F27/006 ,  H01F17/04

    Abstract: A coil component includes a body having first and second surfaces opposing each other in a first direction, first to third coil portions spaced apart from each other in the first direction in the body and having turns wound in the same direction, and an external electrode disposed on the body and connected to each of the first to third coil portions, wherein the number of turns of a portion of the first coil portion disposed in a region between a winding center of the first coil portion and the first surface is greater than the number of turns of a portion of the third coil portion disposed between a winding center of the third coil portion and the second surface, and wherein a distance between the first and second coil portions is wider than a distance between the second and third coil portions.

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20200286677A1

    公开(公告)日：2020-09-10

    申请号：US16533058

    申请日：2019-08-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin LEE ,  Dong Hwan LEE ,  Young Ghyu AHN ,  Chan YOON ,  Won Chul SIM

    IPC: H01F27/29 ,  H01F27/32

    Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.

    COIL ELECTRONIC COMPONENT
    5.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200185148A1

    公开(公告)日：2020-06-11

    申请号：US16586537

    申请日：2019-09-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan YOON ,  Dong Hwan LEE ,  Dong Jin LEE ,  Young Ghyu AHN

    IPC: H01F27/32 ,  H01F27/28 ,  H01F27/29 ,  H01F41/10

    Abstract: A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.

    MULTILAYER ELECTRONIC COMPONENT
    10.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 审中-公开
    多层电子元件

    公开(公告)号：US20160128177A1

    公开(公告)日：2016-05-05

    申请号：US14868254

    申请日：2015-09-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Dong Hwan LEE ,  Byoung Hwa LEE ,  Sang Soo PARK

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

    CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01G4/385 ,  H05K1/0233 ,  H05K2201/1006

    Abstract: A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance, the first and second capacitor parts each comprising at least two among the plurality of internal electrodes with at least one of the ceramic layers or magnetic layers interposed therebetween, and a third capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.

    Abstract translation: 多层电子部件包括：主体，其包括一个或多个陶瓷层或磁性层; 电感器部分，包括设置在所述主体中以垂直于所述主体的下表面的线圈部分; 设置在所述主体中以垂直于所述主体的下表面的多个内部电极; 以及设置在主体的下表面上的输入端子，输出端子和接地端子。 本体包括第一电容器部分和具有不同电容电平的第二电容器部分，第一和第二电容器部分各自包括多个内部电极中的至少两个，其中介于陶瓷层或磁性层中的至少一个插入其间;以及 包括所述多个内部电极中的至少一个和所述线圈部分中的至少一个中的至少一个陶瓷层或磁性层的第三电容器部分。

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