Invention Application
- Patent Title: Printed Circuit Board
- Patent Title (中): 印刷电路板
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Application No.: US14931424Application Date: 2015-11-03
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Publication No.: US20160128218A1Publication Date: 2016-05-05
- Inventor: Eric Bonnet
- Applicant: INGENICO GROUP
- Priority: FR1460599 20141103
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
A main printed circuit board, called a motherboard, of a payment terminal is provided on which a plurality of components is assembled. The components are assembled on the motherboard according to the height of the components so that the components of greater height are situated at a first end of the board and the components of smaller height are situated at a second end of the board.
Public/Granted literature
- US10405447B2 Printed circuit board Public/Granted day:2019-09-03
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