Invention Application
US20160128218A1 Printed Circuit Board 审中-公开
印刷电路板

  • Patent Title: Printed Circuit Board
  • Patent Title (中): 印刷电路板
  • Application No.: US14931424
    Application Date: 2015-11-03
  • Publication No.: US20160128218A1
    Publication Date: 2016-05-05
  • Inventor: Eric Bonnet
  • Applicant: INGENICO GROUP
  • Priority: FR1460599 20141103
  • Main IPC: H05K7/02
  • IPC: H05K7/02
Printed Circuit Board
Abstract:
A main printed circuit board, called a motherboard, of a payment terminal is provided on which a plurality of components is assembled. The components are assembled on the motherboard according to the height of the components so that the components of greater height are situated at a first end of the board and the components of smaller height are situated at a second end of the board.
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