Invention Application
- Patent Title: THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MADE THEREFROM
- Patent Title (中): 热塑性树脂组合物及其制品
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Application No.: US14812828Application Date: 2015-07-29
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Publication No.: US20160130435A1Publication Date: 2016-05-12
- Inventor: Seungjoon Hwang , Kyunghae Lee , Chansu Kim , Jun Chwae
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0156249 20141111
- Main IPC: C08L67/04
- IPC: C08L67/04 ; C08K5/00

Abstract:
A thermoplastic resin composition including a first thermoplastic polymer and a second thermoplastic polymer, wherein the first thermoplastic polymer is a block copolymer including a plurality of polymer blocks, at least one of the plurality of polymer blocks includes a random copolymer, and at least one structural unit of the first thermoplastic polymer and a structural unit of the second thermoplastic polymer are stereoisomers, a molded article made therefrom, and methods of making the same.
Information query