公开(公告)号：US20230101854A1

公开(公告)日：2023-03-30

申请号：US17713688

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyejin Bae ,  Hwangsuk Kim ,  Minsik Min ,  Sangho Park ,  Soonok Jeon ,  Yeonsook Chung ,  Hyesung Choi ,  Jong Soo Kim ,  Jun Chwae ,  Hyeonho Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: An organometallic compound, represented by Formula 1: wherein M1 is a transition metal; X10 is C; X11 to X14, X20, X30 to X36, and X40 are each independently C or N; ring A20 and ring A40 are each independently a C5-C30 carbocyclic group or a C1-C30 heterocyclic group; and R1 to R5, R10, R20, R31, R32, R40, R51, R52, T1, b10, b20, b31, b32, and b40 are as defined herein.

公开(公告)号：US20210167303A1

公开(公告)日：2021-06-03

申请号：US17035858

申请日：2020-09-29

Applicant: Samsung Electronics Co., Ltd. ,  University of Ulsan Foundation for Industry Cooperation

Inventor： Sangmo Kim ,  Minhyung Lee ,  Minsik Min ,  Hyejin Bae ,  Jhunmo Son ,  Yongsik Jung ,  Hyeonho Choi ,  Younghoon Lee ,  Hasup Lee ,  Jun Chwae

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06

Abstract: An organometallic compound represented by Formula 1, an organic light-emitting device including the organometallic compound, and a diagnostic composition including the organometallic compound are provided: M1(L11)n11(L12)n12  Formula 1 wherein, in Formula 1, L11 may be a ligand represented by Formula 1-1, and the other substituents may be understood by referring to the descriptions thereof provided in the detailed description:

公开(公告)号：US20200280003A1

公开(公告)日：2020-09-03

申请号：US16750214

申请日：2020-01-23

Applicant: Samsung Electronics Co., Ltd. ,  SAMSUNG SDI CO., LTD.

Inventor： Minsik Min ,  Sangmo Kim ,  Hosuk Kang ,  Wook Kim ,  Sungho Nam ,  Hyejin Bae ,  Jhunmo Son ,  Yongsik Jung ,  Jun Chwae

IPC: H01L51/00 ,  C07F15/00 ,  C09K11/06

Abstract: Provided are the organometallic compound represented by Formula 1 and an organic light-emitting device including the same: M, X1 to X4, X11, ring CY2 to ring CY4, T1, T2, R1 to R4, and a1 to a4 in Formula 1 are the same as described in the present specification.

公开(公告)号：US10160857B2

公开(公告)日：2018-12-25

申请号：US14830233

申请日：2015-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chansu Kim ,  Kyunghae Lee ,  Jun Chwae ,  Mooho Lee ,  Kwangmyung Cho

IPC: C08L67/04 ,  C08K9/08 ,  C08K3/36

Abstract: A thermoplastic resin composition including a polylactic acid and organic-inorganic composite particles, wherein the composite particles include an inorganic nanoparticle core and a coating layer formed on the core, wherein the coating layer includes a copolymer, and a molded article made therefrom.

公开(公告)号：US20160185954A1

公开(公告)日：2016-06-30

申请号：US14848057

申请日：2015-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghae Lee ,  Seungjoon Hwang ,  Namsoo Park ,  Mooho Lee ,  Jun Chwae

IPC: C08L67/04 ,  C08J5/00

CPC classification number: C08L67/04 ,  C08K5/0016 ,  C08K5/0083 ,  C08L23/0846 ,  C08L23/0853

Abstract: A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.

Abstract translation: 包含聚乳酸，玻璃化转变温度低于聚乳酸的热塑性聚合物，成核剂和反应性增塑剂的热塑性树脂组合物，由其制成的模制品，以及制备该热塑性树脂组合物的方法。

公开(公告)号：US11844266B2

公开(公告)日：2023-12-12

申请号：US16750214

申请日：2020-01-23

Applicant: Samsung Electronics Co., Ltd. ,  SAMSUNG SDI CO., LTD.

Inventor： Minsik Min ,  Sangmo Kim ,  Hosuk Kang ,  Wook Kim ,  Sungho Nam ,  Hyejin Bae ,  Jhunmo Son ,  Yongsik Jung ,  Jun Chwae

IPC: H01L51/54 ,  H10K85/30 ,  C07F15/00 ,  C09K11/06 ,  H10K50/11 ,  H10K101/10

CPC classification number: H10K85/346 ,  C07F15/0086 ,  C09K11/06 ,  C09K2211/1029 ,  C09K2211/1044 ,  C09K2211/185 ,  H10K50/11 ,  H10K2101/10

Abstract: Provided are the organometallic compound represented by Formula 1 and an organic light-emitting device including the same:






M, X1 to X4, X11, ring CY2 to ring CY4, T1, T2, R1 to R4, and a1 to a4 in Formula 1 are the same as described in the present specification.

公开(公告)号：US11713333B2

公开(公告)日：2023-08-01

申请号：US16892487

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Aram Jeon ,  Seungyeon Kwak ,  Kum Hee Lee ,  Jun Chwae ,  Whail Choi ,  Kyuyoung Hwang ,  Yoonhyun Kwak ,  Byoungki Choi

IPC: C07F15/00 ,  H01L51/00 ,  H10K85/30 ,  H10K30/30 ,  H10K50/15 ,  H10K50/16 ,  H10K50/17

CPC classification number: C07F15/0033 ,  H10K85/342 ,  H10K30/353 ,  H10K50/15 ,  H10K50/16 ,  H10K50/17

Abstract: Provided are an organometallic compound, an organic light-emitting device including the organometallic compound, and a diagnostic composition including the organometallic compound.

公开(公告)号：US20210347798A1

公开(公告)日：2021-11-11

申请号：US17193095

申请日：2021-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsik MIN ,  Hyejin BAE ,  Soonok JEON ,  Jiwhan KIM ,  Satoko ISHIBE ,  Hasup LEE ,  Sooghang IHN ,  Jun Chwae

IPC: C07F15/00 ,  H01L51/00

Abstract: Provided are an organometallic compound represented by Formula 1, an organic light-emitting device including the organometallic compound, and a diagnostic composition including the organometallic compound. In Formula 1, substituents may be understood as described in the detailed description.

公开(公告)号：US20210163517A1

公开(公告)日：2021-06-03

申请号：US16892487

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Aram Jeon ,  Seungyeon Kwak ,  Kum Hee Lee ,  Jun Chwae ,  Whail Choi ,  Kyuyoung Hwang ,  Yoonhyun Kwak ,  Byoungki Choi

IPC: C07F15/00 ,  H01L51/00

Abstract: Provided are an organometallic compound, an organic light-emitting device including the organometallic compound, and a diagnostic composition including the organometallic compound.

公开(公告)号：US20160130435A1

公开(公告)日：2016-05-12

申请号：US14812828

申请日：2015-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjoon Hwang ,  Kyunghae Lee ,  Chansu Kim ,  Jun Chwae

IPC: C08L67/04 ,  C08K5/00

CPC classification number: C08L67/04 ,  C08K5/0016

Abstract: A thermoplastic resin composition including a first thermoplastic polymer and a second thermoplastic polymer, wherein the first thermoplastic polymer is a block copolymer including a plurality of polymer blocks, at least one of the plurality of polymer blocks includes a random copolymer, and at least one structural unit of the first thermoplastic polymer and a structural unit of the second thermoplastic polymer are stereoisomers, a molded article made therefrom, and methods of making the same.

Abstract translation: 一种包含第一热塑性聚合物和第二热塑性聚合物的热塑性树脂组合物，其中所述第一热塑性聚合物是包含多个聚合物嵌段的嵌段共聚物，所述多个聚合物嵌段中的至少一个包括无规共聚物，和至少一个结构 第一热塑性聚合物的单位和第二热塑性聚合物的结构单元是立体异构体，由其制成的模制品及其制备方法。