Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE WITH INCORPORATED INDUCTANCE ELEMENT
- Patent Title (中): 具有并入电感元件的半导体封装
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Application No.: US14536363Application Date: 2014-11-07
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Publication No.: US20160133614A1Publication Date: 2016-05-12
- Inventor: Shiqun GU , Ratibor RADOJCIC , Mustafa BADAROGLU , Chunlei SHI , Yuancheng Christopher PAN
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/522 ; H01L23/498 ; H01L21/683 ; H01L21/56 ; H01L21/768 ; H01L21/48 ; H01L25/065 ; H01L25/00
Abstract:
The present disclosure provides semiconductor packages and methods for fabricating semiconductor packages. The semiconductor package may comprise a semiconductor device mounted to a first substrate, a voltage regulator mounted to the first substrate and coupled to the semiconductor device, and an inductive element located on a perimeter of the semiconductor device and coupled to the voltage regulator, wherein the inductive element is formed by a plurality of interconnected conductive elements extending vertically from the first substrate.
Information query
IPC分类:
