Invention Application
US20160136938A1 SYSTEMS AND METHODS FOR BONDING SURFACES USING A RELEASABLE ADHESIVE 审中-公开
使用可释放粘合剂粘结表面的系统和方法

SYSTEMS AND METHODS FOR BONDING SURFACES USING A RELEASABLE ADHESIVE
Abstract:
A releasable adhesive system for joining a first surface to a second surface. The system includes a primary material having a first portion including at least one first-portion molecule configured to be positioned parallel with at least one first-surface molecule of the first surface, and a second portion, opposite the first portion, including at least one second-portion molecule configured to be positioned parallel with at least second surfaced one molecule of the second surface. The first surface molecule, positioned parallel with the first-surface molecule, is configured to maintain bonds between the first portion and the first surface up to one or more pre-determined force scenarios, such as pre-determined shear, pull, and peel forces being exerted on the first surface. The second portion can function similarly with respect to the second surface. A method is also provided for joining the first surface to the second surface using such releasable adhesive.
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