Invention Application
US20160136938A1 SYSTEMS AND METHODS FOR BONDING SURFACES USING A RELEASABLE ADHESIVE
审中-公开
使用可释放粘合剂粘结表面的系统和方法
- Patent Title: SYSTEMS AND METHODS FOR BONDING SURFACES USING A RELEASABLE ADHESIVE
- Patent Title (中): 使用可释放粘合剂粘结表面的系统和方法
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Application No.: US14938682Application Date: 2015-11-11
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Publication No.: US20160136938A1Publication Date: 2016-05-19
- Inventor: Raymond Guo , John P. Spicer , Yhu-tin Lin , Ryan C. Sekol , Jeffrey A. Abell , Mark A. Smith
- Applicant: GM Global Technology Operations LLC
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B3/26 ; C09J9/00 ; B32B7/12

Abstract:
A releasable adhesive system for joining a first surface to a second surface. The system includes a primary material having a first portion including at least one first-portion molecule configured to be positioned parallel with at least one first-surface molecule of the first surface, and a second portion, opposite the first portion, including at least one second-portion molecule configured to be positioned parallel with at least second surfaced one molecule of the second surface. The first surface molecule, positioned parallel with the first-surface molecule, is configured to maintain bonds between the first portion and the first surface up to one or more pre-determined force scenarios, such as pre-determined shear, pull, and peel forces being exerted on the first surface. The second portion can function similarly with respect to the second surface. A method is also provided for joining the first surface to the second surface using such releasable adhesive.
Public/Granted literature
- US10350852B2 Systems for bonding surfaces using a releasable adhesive Public/Granted day:2019-07-16
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