Invention Application
- Patent Title: SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND MANUFACTURING PROCESS THEREOF
- Patent Title (中): 具有电线连接和烧结区域的半导体器件及其制造工艺
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Application No.: US14846010Application Date: 2015-09-04
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Publication No.: US20160148896A1Publication Date: 2016-05-26
- Inventor: Agatino Minotti , Gaetano Montalto
- Applicant: STMicroelectronics S.R.L.
- Priority: ITTO2014A000975 20141126
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.
Public/Granted literature
- US09786626B2 Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof Public/Granted day:2017-10-10
Information query
IPC分类:
