公开(公告)号：US20170365577A1

公开(公告)日：2017-12-21

申请号：US15697704

申请日：2017-09-07

Applicant: STMicroelectronics S.R.L.

Inventor： Agatino Minotti ,  Gaetano Montalto

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/29 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/03438 ,  H01L2224/05552 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/29111 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/4847 ,  H01L2224/48491 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/35 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/2076 ,  H01L2924/00

Abstract: An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.

公开(公告)号：US09786626B2

公开(公告)日：2017-10-10

申请号：US14846010

申请日：2015-09-04

Applicant: STMicroelectronics S.R.L.

Inventor： Agatino Minotti ,  Gaetano Montalto

IPC: H01L27/00 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/4847 ,  H01L2224/48491 ,  H01L2224/48839 ,  H01L2924/00014 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/2076

Abstract: An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.

公开(公告)号：US20160148896A1

公开(公告)日：2016-05-26

申请号：US14846010

申请日：2015-09-04

Applicant: STMicroelectronics S.R.L.

Inventor： Agatino Minotti ,  Gaetano Montalto

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/4847 ,  H01L2224/48491 ,  H01L2224/48839 ,  H01L2924/00014 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/2076

Abstract: An electronic device includes: a semiconductor body; a front metallization region; a top buffer region, arranged between the front metallization region and the semiconductor body; and a conductive wire, electrically connected to the front metallization region. The top buffer region is at least partially sintered.

Abstract translation: 电子设备包括：半导体本体; 前金属化区域; 布置在前金属化区域和半导体本体之间的顶部缓冲区域; 以及电连接到前金属化区域的导线。 顶部缓冲区域至少部分地被烧结。

公开(公告)号：US09986631B2

公开(公告)日：2018-05-29

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L23/053 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H05K1/11 ,  H05K3/10 ,  H05K7/14 ,  H05K13/00 ,  H01L23/24 ,  H01L23/36 ,  H01L23/473 ,  H01L23/492

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

公开(公告)号：US20170064808A1

公开(公告)日：2017-03-02

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K1/02 ,  H05K13/00 ,  H05K3/10 ,  H05K1/11 ,  H01L23/00 ,  H01L25/18 ,  H01L23/367 ,  H01L23/492 ,  H01L23/34 ,  H01L25/00 ,  H01L23/08 ,  H01L23/053 ,  H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Abstract translation: 一种电子电源模块，包括容纳堆叠的壳体，其包括：DBC型等的第一衬底; 集成了具有一个或多个导电端子的电子部件，机电和热耦合到第一基板; 以及DBC型等的第二基板，其在第一基板上延伸并且在模具上方并且呈现面向模具的导电路径。 模具通过烧结的导热浆的第一耦合区域机械地和热耦合到第一衬底，并且电子部件的一个或多个导电端子通过机械，电和热耦合到第二衬底的导电路径，由 烧结导热浆的第二耦合区域。