Invention Application
- Patent Title: METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR
- Patent Title (中): 电导电胶膜制造方法,电导电胶膜及制造连接器的方法
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Application No.: US14904443Application Date: 2014-07-28
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Publication No.: US20160149366A1Publication Date: 2016-05-26
- Inventor: Yasushi AKUTSU
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-157099 20130729
- International Application: PCT/JP2014/069794 WO 20140728
- Main IPC: H01R43/20
- IPC: H01R43/20 ; C09J7/02 ; C09J9/02

Abstract:
An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.
Information query