METHOD OF PRODUCING ANISOTROPIC CONDUCTIVE FILM AND ANISOTROPIC CONDUCTIVE FILM

    公开(公告)号:US20190224889A1

    公开(公告)日:2019-07-25

    申请号:US16369539

    申请日:2019-03-29

    Abstract: Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

    ANISOTROPIC CONDUCTIVE FILM, MANUFACTURING METHOD THEREOF, AND CONNECTION STRUCTURE

    公开(公告)号:US20170359904A1

    公开(公告)日:2017-12-14

    申请号:US15541621

    申请日:2016-01-05

    Abstract: An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.

    ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

    公开(公告)号:US20170103959A1

    公开(公告)日:2017-04-13

    申请号:US15129443

    申请日:2015-03-20

    Abstract: An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film thickness direction, and a second conductive particle layer in which conductive particles are dispersed at a depth different from that in the first conductive particle layer. In the respective conductive particle layers, the closest distances between the adjacent conductive particles are 2 times or more the average particle diameters of the conductive particles.

    CONNECTION BODY AND CONNECTION BODY MANUFACTURING METHOD
    6.
    发明申请
    CONNECTION BODY AND CONNECTION BODY MANUFACTURING METHOD 审中-公开
    连接体和连接体制造方法

    公开(公告)号:US20160381801A1

    公开(公告)日:2016-12-29

    申请号:US15112872

    申请日:2015-01-13

    Abstract: Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.

    Abstract translation: 确保电子部件与电路基板的布线中的间距减小的电路基板与电子部件的电极之间的导通,并防止电子部件的电极端子之间的短路。 连接体具有通过各向异性导电粘合剂连接到电路基板的电子部件; 各向异性导电粘合剂含有导电性粒子规则排列的粘合剂树脂层; 形成在电子部件上的连接电极之间的空间中的导电粒子之间的粒子间距离大于截留在形成于电路基板上的连接电极和基板电极之间的导电粒子之间的粒子间距离。

    ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM

    公开(公告)号:US20220199565A1

    公开(公告)日:2022-06-23

    申请号:US17690276

    申请日:2022-03-09

    Inventor: Yasushi AKUTSU

    Abstract: An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.

    CONDUCTIVE PARTICLE-DISPOSED FILM, METHOD FOR PRODUCING THE SAME, TEST PROBE UNIT, AND CONTINUITY TEST METHOD

    公开(公告)号:US20190293683A1

    公开(公告)日:2019-09-26

    申请号:US16465012

    申请日:2017-11-20

    Abstract: A conductive particle-disposed film of the present invention useful for a test probe unit for a continuity test of a fine-pitch continuity test object such as a semiconductor device is configured so that conductive particles are disposed in the surface direction of the elastomer film. The thickness of the elastomer film approximately coincides with the average particle diameter of the conductive particles. Ends of the conductive particles are positioned in the vicinity of respective outermost faces of both surfaces of the elastomer film. The same or different conductive particle-disposed films may be layered. A pressure-sensitive adhesive layer may be formed on at least one surface of the conductive particle-disposed film.

    ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20190067234A1

    公开(公告)日:2019-02-28

    申请号:US16176923

    申请日:2018-10-31

    Abstract: An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer 3. The anisotropic conductive film 1A has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced.

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