Abstract:
Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.
Abstract:
An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.
Abstract:
An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.
Abstract:
A anisotropic conductive film includes: an electrically insulating adhesive layer; electrically conductive particles disposed in lattice form in the electrically insulating adhesive layer; a reference electrically conductive particle defined, an electrically conductive particle closest to the reference electrically conductive particle defined as a first electrically conductive particle, an electrically conductive particle equally close or next closest to the reference electrically conductive particle regarding the first electrically conductive particle defined as a second electrically conductive particle. The second electrically conductive particle absent from lattice form axis including the reference electrically conductive particle and first electrically conductive particle. A projection image in the anisotropic conductive film longitudinal direction of the reference electrically conductive particle and first electrically conductive particle or second electrically conductive particle overlap and the anisotropic conductive film projection image in a short-side direction the reference electrically conductive particle and second electrically conductive particle or first electrically conductive particle overlap.
Abstract:
An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film thickness direction, and a second conductive particle layer in which conductive particles are dispersed at a depth different from that in the first conductive particle layer. In the respective conductive particle layers, the closest distances between the adjacent conductive particles are 2 times or more the average particle diameters of the conductive particles.
Abstract:
Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.
Abstract:
An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.
Abstract:
An anisotropic electrically conductive film has a structure wherein the electrically conductive particles are disposed on or near the surface of an electrically insulating adhesive base layer, or a structure wherein an electrically insulating adhesive base layer and an electrically insulating adhesive cover layer are laminated together and the electrically conductive particles are disposed near the interface therebetween. Electrically conductive particle groups configured from two or more electrically conductive particles are disposed in a lattice point region of a planar lattice pattern. A preferred lattice point region is a circle centered on a lattice point. A radius of the circle is not less than two times and not more than seven times the average particle diameter of the electrically conductive particles.
Abstract:
A conductive particle-disposed film of the present invention useful for a test probe unit for a continuity test of a fine-pitch continuity test object such as a semiconductor device is configured so that conductive particles are disposed in the surface direction of the elastomer film. The thickness of the elastomer film approximately coincides with the average particle diameter of the conductive particles. Ends of the conductive particles are positioned in the vicinity of respective outermost faces of both surfaces of the elastomer film. The same or different conductive particle-disposed films may be layered. A pressure-sensitive adhesive layer may be formed on at least one surface of the conductive particle-disposed film.
Abstract:
An anisotropic conductive film 1A includes a conductive particle array layer 4 in which a plurality of conductive particles 2 are arrayed in a prescribed manner and held in an insulating resin layer 3. The anisotropic conductive film 1A has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer 3 holding the array of the conductive particles 2 is asymmetric with respect to the conductive particle 2. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film 1A, short circuits and conductive failure can be reduced.