Invention Application
- Patent Title: TRANSPARENT CONDUCTIVE LAMINATED FILM, METHOD FOR MANUFACTURING SAME, AND TOUCH PANEL
- Patent Title (中): 透明导电层压膜,其制造方法和触控面板
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Application No.: US14392175Application Date: 2013-10-17
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Publication No.: US20160152002A1Publication Date: 2016-06-02
- Inventor: Kunihiro Inui , Takeshi Saito , Miki Okamoto , Shinsuke Akizuki
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP2013-131774 20130624
- International Application: PCT/JP2013/078232 WO 20131017
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/32 ; B32B37/24 ; B32B27/08 ; B32B37/12 ; B32B27/36 ; B32B3/26

Abstract:
A transparent conductive laminated film, comprising a laminated film comprising a plurality of transparent film substrates and a transparent cured adhesive layer having a storage modulus of 1×107 Pa or more at 140° C., wherein the plurality of transparent film substrates include a first transparent film substrate and a second transparent film substrate and are laminated with the transparent cured adhesive layer interposed between adjacent ones of the film substrates; and, a first transparent conductive layer provided on a surface of the first film substrate opposite to the transparent cured adhesive layer.
Information query