发明申请
US20160157356A1 SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD
审中-公开
表面处理铜箔，带载体的铜箔，基板，树脂基板，印刷电路板，铜箔层压板及生产印刷电路板的方法
- 专利标题： SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD
- 专利标题（中）： 表面处理铜箔，带载体的铜箔，基板，树脂基板，印刷电路板，铜箔层压板及生产印刷电路板的方法
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申请号： US14907486申请日： 2014-07-24
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公开(公告)号： US20160157356A1公开(公告)日： 2016-06-02
- 发明人: MICHIYA KOHIKI
- 申请人： JX NIPPON MINING & METALS CORPORATION
- 优先权： JP2013-153732 20130724; JP2013-153765 20130724
- 国际申请： PCT/JP2014/069624 WO 20140724
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; H05K3/38 ; B32B15/08 ; H05K3/20
摘要：
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.
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