INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIES

Invention Application

US20160163650A1 INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIES 有权

Title translation: 用于防止机械损伤和其他目的的刚性层的集成电路组件以及制造这种组件的方法

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Patent Title: INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIES
Patent Title (中): 用于防止机械损伤和其他目的的刚性层的集成电路组件以及制造这种组件的方法
Application No.: US14704714

Application Date: 2015-05-05
Publication No.: US20160163650A1

Publication Date: 2016-06-09
Inventor: Guilian GAO , Cyprian Emeka UZOH , Charles G. WOYCHIK , Hong SHEN , Arkalgud R. SITARAM , Liang WANG , Akash AGRAWAL , Rajesh KATKAR
Applicant: Invensas Corporation
Main IPC: H01L23/538
IPC: H01L23/538 ; H01L25/00 ; H01L23/00 ; H01L25/065

INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIES

Abstract:

Die (110) and/or undiced wafers and/or multichip modules (MCMs) are attached on top of an interposer (120) or some other structure (e.g. another integrated circuit) and are covered by an encapsulant (160). Then the interposer is thinned from below. Before encapsulation, a layer (410) more rigid than the encapsulant is formed on the interposer around the die to reduce or eliminate interposer dishing between the die when the interposer is thinned by a mechanical process (e.g. CMP). Other features are also provided.

Abstract(Chinese):

模具（110）和/或未开封的晶片和/或多芯片模块（MCM）被附接在插入器（120）或一些其它结构（例如另一集成电路）的顶部上并被密封剂（160）覆盖。然后插入器从下面变薄。在封装之前，在封装周围的插入件周围形成比密封剂更刚性的层（410），以通过机械工艺（例如CMP）来减小或消除插入件在裸片间的凹陷。还提供其他功能。

Public/Granted literature

US09548273B2 Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies Public/Granted day:2017-01-17

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/52	.用于在处于工作中的器件内部从一个组件向另一个组件通电的装置
H01L23/538	..制作在绝缘衬底上或内的多个半导体芯片间的互连结构