Invention Application
- Patent Title: Integrated Circuit Comprising Group III-N Transistors Monolithically Integrated on a Silicon Substrate and a Method for Manufacturing Thereof
- Patent Title (中): 集成电路,包括单晶硅集成在硅基板上的III-N晶体管及其制造方法
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Application No.: US14963650Application Date: 2015-12-09
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Publication No.: US20160163695A1Publication Date: 2016-06-09
- Inventor: Stefaan Decoutere , Niels Posthuma , Shuzhen You
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Priority: EP14196952.7 20141209
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L21/761 ; H01L21/22 ; H01L29/778 ; H01L21/74

Abstract:
An integrated circuit comprising a first III-N transistor having a source region and a second III-N transistor having a source region, both transistors being monolithically integrated on a common silicon substrate of a first doping type and separated from each-other by an isolation region, the substrate comprising underneath the first transistor a well of a first doping type electrically connected to the source region of the first transistor and comprising underneath the second transistor a well of a second doping type electrically connected to the source region of the second transistor, thereby forming a junction diode in the substrate between the sources of the first and the second transistor.
Information query
IPC分类: