Invention Application
US20160163695A1 Integrated Circuit Comprising Group III-N Transistors Monolithically Integrated on a Silicon Substrate and a Method for Manufacturing Thereof 审中-公开
集成电路,包括单晶硅集成在硅基板上的III-N晶体管及其制造方法

  • Patent Title: Integrated Circuit Comprising Group III-N Transistors Monolithically Integrated on a Silicon Substrate and a Method for Manufacturing Thereof
  • Patent Title (中): 集成电路,包括单晶硅集成在硅基板上的III-N晶体管及其制造方法
  • Application No.: US14963650
    Application Date: 2015-12-09
  • Publication No.: US20160163695A1
    Publication Date: 2016-06-09
  • Inventor: Stefaan DecoutereNiels PosthumaShuzhen You
  • Applicant: IMEC VZW
  • Applicant Address: BE Leuven
  • Assignee: IMEC VZW
  • Current Assignee: IMEC VZW
  • Current Assignee Address: BE Leuven
  • Priority: EP14196952.7 20141209
  • Main IPC: H01L27/06
  • IPC: H01L27/06 H01L29/06 H01L21/761 H01L21/22 H01L29/778 H01L21/74
Integrated Circuit Comprising Group III-N Transistors Monolithically Integrated on a Silicon Substrate and a Method for Manufacturing Thereof
Abstract:
An integrated circuit comprising a first III-N transistor having a source region and a second III-N transistor having a source region, both transistors being monolithically integrated on a common silicon substrate of a first doping type and separated from each-other by an isolation region, the substrate comprising underneath the first transistor a well of a first doping type electrically connected to the source region of the first transistor and comprising underneath the second transistor a well of a second doping type electrically connected to the source region of the second transistor, thereby forming a junction diode in the substrate between the sources of the first and the second transistor.
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