发明申请
- 专利标题： Semiconductor Module
- 专利标题（中）： 半导体模块
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申请号： US14910355申请日： 2014-10-06
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公开(公告)号： US20160181221A1公开(公告)日： 2016-06-23
- 发明人: Takashi SUNAGA , Noboru KANEKO , Osamu MIYOSHI , Ryoichi SUZUKI
- 申请人： NSK LTD.
- 优先权： JP2013-218433 20131021; JP2013-228391 20131101; JP2014-032022 20140221; JP2014-090389 20140424; JP2014-091665 20140425; JP2014-104799 20140521; JP2014-124853 20140618
- 国际申请： PCT/JP2014/005085 WO 20141006
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498 ; H01L23/492 ; H01L29/78 ; H01L29/739
摘要：
To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
公开/授权文献
- US09633967B2 Semiconductor module 公开/授权日：2017-04-25
信息查询
IPC分类:
