发明申请
- 专利标题： HYDROGEN-RELEASING FILM
- 专利标题（中）： 氢释放膜
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申请号： US14910373申请日： 2014-07-30
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公开(公告)号： US20160181583A1公开(公告)日： 2016-06-23
- 发明人: Takahiro FUKUOKA , Yoshiko KIRA , Kyoko ISHII , Kenta HATA , Hiroshi YUKAWA , Tomonori NANBU
- 申请人： NITTO DENKO CORPORATION , NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY , INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
- 申请人地址： JP Ibaraki-shi, Osaka JP Nagoya-shi, Aichi JP Hachioji-shi, Tokyo
- 专利权人： NITTO DENKO CORPORATION,NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY,INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
- 当前专利权人： NITTO DENKO CORPORATION,NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY,INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JAPAN
- 当前专利权人地址： JP Ibaraki-shi, Osaka JP Nagoya-shi, Aichi JP Hachioji-shi, Tokyo
- 优先权： JP2013-163071 20130806; JP2014-151902 20140725
- 国际申请： PCT/JP2014/069996 WO 20140730
- 主分类号： H01M2/12
- IPC分类号： H01M2/12 ; B01D53/22 ; C22C5/04 ; C22C9/00 ; H01G9/12 ; H01M10/0525
摘要：
The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrogen-releasing film is characterized by containing a Pd—Cu alloy, and the Cu content in the Pd—Cu alloy being at least 30 mol %.
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