Invention Application
- Patent Title: HIGH DENSITY CABLED MIDPLANES AND BACKPLANES
- Patent Title (中): 高密度平台和背板
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Application No.: US14578707Application Date: 2014-12-22
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Publication No.: US20160181719A1Publication Date: 2016-06-23
- Inventor: Vladimir Tamarkin , Wayne Genetti , Keith Mease , Mark Wessel
- Applicant: Intel Corporation
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01R43/20

Abstract:
A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
Public/Granted literature
- US09413097B2 High density cabled midplanes and backplanes Public/Granted day:2016-08-09
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