公开(公告)号：US20160174409A1

公开(公告)日：2016-06-16

申请号：US14570297

申请日：2014-12-15

Applicant: Intel Corporation

Inventor： Keith Mease ,  William F. Federer

IPC: H05K7/20

CPC classification number: H05K7/20727 ,  H05K7/20172

Abstract: An electronic device includes a chassis having a recess and a fan assembly captured by the recess, wherein the fan assembly is moveable out of the recess to rotate such that airflow through the fan assembly moves in different directions to cool the electronic device as a function of such rotation.

Abstract translation: 电子设备包括具有凹部和由凹部捕获的风扇组件的底盘，其中风扇组件可从凹槽移动以旋转，使得通过风扇组件的气流沿不同方向移动，以将电子设备冷却为 这样的旋转。

公开(公告)号：US09999161B2

公开(公告)日：2018-06-12

申请号：US14570297

申请日：2014-12-15

Applicant: Intel Corporation

Inventor： Keith Mease ,  William F Federer

IPC: H05K7/20

CPC classification number: H05K7/20727 ,  H05K7/20172

Abstract: An electronic device includes a chassis having a recess and a fan assembly captured by the recess, wherein the fan assembly is moveable out of the recess to rotate such that airflow through the fan assembly moves in different directions to cool the electronic device as a function of such rotation.

公开(公告)号：US20160352038A1

公开(公告)日：2016-12-01

申请号：US15231391

申请日：2016-08-08

Applicant: Intel Corporation

Inventor： Vladimir Tamarkin ,  Wayne Genetti ,  Keith Mease ,  Mark Wessel

IPC: H01R13/502 ,  H04L12/931 ,  H04Q1/02 ,  H01R43/20

CPC classification number: H01R13/502 ,  H01R43/20 ,  H04L49/40 ,  H04Q1/15

Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

公开(公告)号：US20160181719A1

公开(公告)日：2016-06-23

申请号：US14578707

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： Vladimir Tamarkin ,  Wayne Genetti ,  Keith Mease ,  Mark Wessel

IPC: H01R13/502 ,  H01R43/20

CPC classification number: H01R13/502 ,  H01R43/20 ,  H04L49/40 ,  H04Q1/15

Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

Abstract translation: 电缆中平面包括沿着连接到有线中平面两侧的线路卡的第一连接器组和第二连接器组之间的平面的第一支撑板。 第一连接器组和第二连接器组包括连接器片。 布线子层包括电缆片，以在第一连接器组件的连接器的第一连接器片与第二连接器组的连接器的第一连接片之间提供连接，使得第一布线子层将每个连接器 的第一连接器组，通过一个电缆片，连接到第二连接器组的连接器。 添加附加的布线子层，并且设置平行于第一支撑板的第二支撑板以包围并支撑第一支撑板和第二支撑板之间的布线子层。 描述其他设备和方法。

公开(公告)号：US09917392B2

公开(公告)日：2018-03-13

申请号：US15231391

申请日：2016-08-08

Applicant: Intel Corporation

Inventor： Vladimir Tamarkin ,  Wayne Genetti ,  Keith Mease ,  Mark Wessel

IPC: H01R13/502 ,  H01R43/20 ,  H04L12/931 ,  H04Q1/02

CPC classification number: H01R13/502 ,  H01R43/20 ,  H04L49/40 ,  H04Q1/15

Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

公开(公告)号：US09413097B2

公开(公告)日：2016-08-09

申请号：US14578707

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： Vladimir Tamarkin ,  Wayne Genetti ,  Keith Mease ,  Mark Wessel

IPC: H01R13/502 ,  H01R43/20

CPC classification number: H01R13/502 ,  H01R43/20 ,  H04L49/40 ,  H04Q1/15

Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

Abstract translation: 电缆中平面包括沿着连接到有线中平面两侧的线路卡的第一连接器组和第二连接器组之间的平面的第一支撑板。 第一连接器组和第二连接器组包括连接器片。 布线子层包括电缆片，以在第一连接器组件的连接器的第一连接器切片与第二连接器组的连接器的第一连接器片之间提供连接，使得第一布线子层将每个连接器 的第一连接器组，通过一个电缆片，连接到第二连接器组的连接器。 添加附加的布线子层，并且设置平行于第一支撑板的第二支撑板以包围并支撑第一支撑板和第二支撑板之间的布线子层。 描述其他设备和方法。