Invention Application
- Patent Title: CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
- Patent Title (中): CORED焊丝与罗斯通和热固性材料
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Application No.: US14586678Application Date: 2014-12-30
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Publication No.: US20160184938A1Publication Date: 2016-06-30
- Inventor: Yonggang JIN , Yun LIU
- Applicant: STMICROELECTRONICS PTE LTD
- Main IPC: B23K35/36
- IPC: B23K35/36 ; B23K35/02
Abstract:
The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.
Information query
IPC分类:
