公开(公告)号：US20210159136A1

公开(公告)日：2021-05-27

申请号：US17145028

申请日：2021-01-08

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yun LIU ,  David GANI

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/304 ,  H01L23/28

Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.

公开(公告)号：US20190267302A1

公开(公告)日：2019-08-29

申请号：US16270927

申请日：2019-02-08

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yun LIU ,  David GANI

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.

公开(公告)号：US20180229334A1

公开(公告)日：2018-08-16

申请号：US15950719

申请日：2018-04-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Yun LIU

IPC: B23K35/36 ,  B23K35/02

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3613

Abstract: The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.

公开(公告)号：US20160184938A1

公开(公告)日：2016-06-30

申请号：US14586678

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Yun LIU

IPC: B23K35/36 ,  B23K35/02

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3613

Abstract: The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.

Abstract translation: 本公开涉及一种焊丝，其包括具有松香焊剂和热固性材料两者的芯。 所述焊丝被配置为在单个焊接步骤中提供氧化物去除松香助焊剂到电组件，到电组件的焊料合金以及焊料合金的保护层。