Invention Application
- Patent Title: ELECTROLYTIC COPPER PLATING SOLUTION
- Patent Title (中): 电解铜镀层溶液
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Application No.: US14940681Application Date: 2015-11-13
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Publication No.: US20160186348A1Publication Date: 2016-06-30
- Inventor: Yoko Mizuno , Makoto Sakai , Mutsuko Saito , Toshiyuki Morinaga , Shinjiro Hayashi
- Applicant: Rohm and Haas Electronic Materials LLC
- Priority: JP2014-266608 20141226
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/00 ; H05K1/09 ; H05K3/24
Abstract:
An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution is also described. The electrolytic copper plating solution contains two kinds of specific surfactants.
Information query
