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公开(公告)号：US20160186348A1
公开(公告)日：2016-06-30
申请号：US14940681
申请日：2015-11-13
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Yoko Mizuno , Makoto Sakai , Mutsuko Saito , Toshiyuki Morinaga , Shinjiro Hayashi
Abstract: An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution is also described. The electrolytic copper plating solution contains two kinds of specific surfactants.
Abstract translation: 公开了可以形成矩形电路图案的电解铜电镀溶液。 还描述了通过使用电解铜电镀液在电路板上进行电解电镀的方法和使用电解镀铜液形成的电解电路。 电解铜电镀溶液含有两种特定的表面活性剂。
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Patent Agency Ranking
公开(公告)号：US20170002211A1
公开(公告)日：2017-01-05
申请号：US15157453
申请日：2016-05-18
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Yoko Mizuno , Makoto Kondo , Koichi Yomogida , Toshiyuki Morinaga
IPC: C09D5/08 , H01L21/288 , C23C26/00 , C25D5/48 , C09D179/04 , C09D7/12
CPC classification number: C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
Abstract: A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
Abstract translation: 含有由含氮杂环化合物与表卤代醇反应产物得到的阳离子聚合物的组合物; 和磷化合物。 该组合物可用作金或金合金的表面处理。 该组合物可以密封金或金合金表面上的针孔。
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3.发明授权公开(公告)号：US09169576B2
公开(公告)日：2015-10-27
申请号：US13907433
申请日：2013-05-31
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Mutsuko Saito , Makoto Sakai , Yoko Mizuno , Toshiyuki Morinaga , Shinjiro Hayashi
Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.
Abstract translation: 提供一种电解镀铜溶液，其具有优异的通孔填充能力，而不使用对环境有害的甲醛。 含有具有-X-S-Y-结构的化合物的电解铜电镀溶液，其中X和Y分别是选自氢，碳，硫，氮和氧原子的原子，X和Y可以相同 只有当它们是碳原子和特定的含氮化合物时。 可以通过使用该电解铜电镀溶液，而不会导致电镀外观恶化而形成良好的填充通孔。
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公开(公告)号：US09914838B2
公开(公告)日：2018-03-13
申请号：US15157453
申请日：2016-05-18
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Yoko Mizuno , Makoto Kondo , Koichi Yomogida , Toshiyuki Morinaga
IPC: B05D5/12 , C09D5/08 , H05K1/03 , H05K3/00 , C07D333/04 , C25D3/38 , C08K5/3462 , C07D233/02 , C25D11/24 , C09D7/12 , C09D179/04 , C23C26/00 , C25D5/48 , H01L21/288 , C08G73/06 , C08G59/00 , H05K1/00 , C07D233/00 , C08K5/00 , C08K3/32 , C25D5/12
CPC classification number: C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
Abstract: A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
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公开(公告)号：US09175413B2
公开(公告)日：2015-11-03
申请号：US13727627
申请日：2012-12-27
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Mutsuko Saito , Makoto Sakai , Toshiyuki Morinaga , Shinjiro Hayashi
IPC: C25D3/38 , H01L21/768 , H01L21/288 , H05K3/42
CPC classification number: C25D3/38 , H01L21/2885 , H01L21/76898 , H05K3/424
Abstract: A copper electroplating solution which contains compounds with the structure —X—S—Y— wherein X and Y are, independently atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and ninhydrin. By using this copper electroplating solution, it is possible to form good filled vias without worsening the appearance of the plating.
Abstract translation: 含有结构-X-S-Y-的化合物的铜电镀溶液，其中X和Y独立地为选自氢，碳，硫，氮和氧的原子，X和Y可以相同 只有当它们是碳原子和茚三酮时。 通过使用这种铜电镀溶液，可以形成良好的填充通孔，而不会使电镀的外观恶化。
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6.发明授权公开(公告)号：US09150976B2
公开(公告)日：2015-10-06
申请号：US14043826
申请日：2013-10-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Mutsuko Saito , Makoto Sakai , Yoko Mizuno , Toshiyuki Morinaga , Shinjiro Hayashi
IPC: C25D3/38
CPC classification number: C25D3/38
Abstract: Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.
Abstract translation: 提供不使用甲醛的铜电镀液体，其对环境有害，并且具有优异的通孔填充能力。 本发明的铜电镀液包括具有-X-S-Y-结构的化合物，其中X和Y各自为选自氢原子，碳原子，硫原子，氮原子和氧原子的原子， 并且X和Y只有当它们是碳原子时才可以是相同的，以及特定的尿素衍生物。 当使用铜电镀液时，不会发生外观劣化，并且可以形成良好的填充通孔。
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