Invention Application
- Patent Title: TOUCH SENSOR ASSEMBLY AND METHOD OF MANUFACTURING SAME
- Patent Title (中): 触摸传感器组件及其制造方法
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Application No.: US14977605Application Date: 2015-12-21
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Publication No.: US20160188093A1Publication Date: 2016-06-30
- Inventor: Hyunki KIM , Seungje PARK
- Applicant: LG ELECTRONICS INC.
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Priority: KR10-2014-0189144 20141224
- Main IPC: G06F3/041
- IPC: G06F3/041

Abstract:
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
Public/Granted literature
- US10180748B2 Touch sensor assembly and method of manufacturing same Public/Granted day:2019-01-15
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