A board material structure includes multiple boards and multiple embedded rods. The boards each respectively comprise a protrusion and a groove on their peripheral surfaces. The embedded rods each respectively comprise two side surfaces, wherein one of the two side surfaces is corresponding in shape to the protrusion and the other one of the two side surfaces is corresponding in shape to the groove. Furthermore, a melting point of the board is higher than a melting point of the embedded rod. To construct the board material structure, users can melt the embedded rod to connect and combine two boards. The embedded rods can increase structural rigidness of the board material structure and prevent moisture from permeating into the gaps between the two boards. In addition, the present invention can firmly construct a floor, a cabinet, or a drywall.