Invention Application
- Patent Title: LIGHT EMITTING DEVICE
- Patent Title (中): 发光装置
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Application No.: US15067631Application Date: 2016-03-11
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Publication No.: US20160197250A1Publication Date: 2016-07-07
- Inventor: Motokazu YAMADA
- Applicant: NICHIA CORPORATION
- Priority: JP2012-202952 20120914
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/62 ; H01L33/08

Abstract:
A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a non-adhesive region corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The non-adhesive region is covered with a non-adhesive layer.
Public/Granted literature
- US09768365B2 Light emitting device Public/Granted day:2017-09-19
Information query
IPC分类: