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公开(公告)号:US20250044641A1
公开(公告)日:2025-02-06
申请号:US18924031
申请日:2024-10-23
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
IPC: G02F1/13357
Abstract: A planar light source includes a reflective member. The reflective member defines at least one slit including at least one first slit arranged in a first region extending in a first direction and intersecting a first virtual straight line at a prescribed position in the first region. The first virtual straight line is parallel to the first direction.
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公开(公告)号:US20240282758A1
公开(公告)日:2024-08-22
申请号:US18650941
申请日:2024-04-30
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA , Yuichi YAMADA
IPC: H01L25/075 , F21V7/00 , F21V9/08 , F21V23/00 , F21Y115/10 , G02F1/1335 , G02F1/13357 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
CPC classification number: H01L25/0753 , F21V7/00 , F21V9/08 , F21V23/002 , G02F1/133605 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , F21Y2115/10 , G02F1/133603 , G02F1/133614 , H01L33/507 , H01L33/56 , H01L2224/16225 , H01L2924/181
Abstract: A integrated light-emitting device includes: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.
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公开(公告)号:US20230207756A1
公开(公告)日:2023-06-29
申请号:US18067014
申请日:2022-12-16
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
IPC: H01L33/60 , H01L25/075 , H01L33/62 , H01L23/00
CPC classification number: H01L33/60 , H01L24/13 , H01L24/81 , H01L25/0753 , H01L33/62 , H01L24/16 , H01L2224/1319 , H01L2224/8192 , H01L2224/16225 , H01L2224/81201 , H01L2224/81911 , H01L2933/0058 , H01L2933/0066
Abstract: A method for producing a light-emitting unit includes providing a solder composition on a wiring layer of a substrate. The solder composition contains a solder, a flux, and light-reflective particles. The method further includes placing a light-emitting element having an electrode on the solder composition such that the electrode of the light-emitting element faces the solder composition, and melting the solder by a reflow process to allow the light-reflective particles to move to a surface of the solder composition, and to electrically couple the electrode with the wiring layer via the solder.
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公开(公告)号:US20210265325A1
公开(公告)日:2021-08-26
申请号:US17318819
申请日:2021-05-12
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
IPC: H01L25/075 , H01L33/46 , H01L33/20
Abstract: A light emitting device includes a wiring substrate, and light emitting elements. The light emitting elements are aligned in a first array, and each includes a sapphire substrate having a lower surface, a pair of first lateral surfaces slanted with respect to the lower surface, and a pair of second lateral surfaces perpendicular to the lower surface, with the pair of first lateral surfaces has an acute angle lateral surface and an obtuse angle lateral surface, and a semiconductor layered structure disposed on the sapphire substrate. In a plan view, a direction along which the second lateral surfaces of one of the light emitting elements in the first array extend forms an angle of 45° with respect to a direction along which the second lateral surfaces of an adjacent one of the light emitting elements in the first array extend.
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公开(公告)号:US20200335666A1
公开(公告)日:2020-10-22
申请号:US16922827
申请日:2020-07-07
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
IPC: H01L33/44 , H01L33/62 , H01L25/075 , H05K1/18 , H05K3/00 , F21V21/08 , F21S4/24 , H01L33/08 , H01L33/56
Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a cover member, a reflective member and a light transmissive member. The flexible substrate has a first surface and a second surface opposite to the first surface, and includes a flexible base member and a plurality of wiring portions disposed on a first surface side. The light emitting element is arranged on the first surface of the flexible substrate and electrically connected to the wiring portions. The cover member is arranged on the second surface of the flexible substrate and defines a through hole at a position overlapping the light emitting element in a plan view. The reflective member covers at least a part of a lower surface and at least a part of a side surface of the light emitting element. The light transmissive member covers a top surface of the light emitting element.
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公开(公告)号:US20200176631A1
公开(公告)日:2020-06-04
申请号:US16783496
申请日:2020-02-06
Applicant: Nichia Corporation
Inventor: Isamu NIKI , Motokazu YAMADA , Masahiko SANO , Shuji SHIOJI
Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
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公开(公告)号:US20190326479A1
公开(公告)日:2019-10-24
申请号:US16457594
申请日:2019-06-28
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
IPC: H01L33/44 , H01L33/56 , F21V21/08 , H05K1/18 , H05K3/00 , H01L33/62 , F21S4/24 , H01L33/08 , H01L25/075
Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, and a cover member. The flexible substrate has a first surface and a second surface, and includes a flexible base member and wiring portions disposed on a first surface side. The cover member is arranged on the second surface of the flexible substrate and defines at least a part of a recess defining an air layer. The recess is positioned so that a total maximum thickness of the flexible substrate and the cover member in a region corresponding to a region on the first surface where the at least one light emitting element is arranged is smaller than a total maximum thickness of the flexible substrate and the cover member in a region other than the region corresponding to the region on the first surface where the at least one light emitting element is arranged.
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公开(公告)号:US20190305197A1
公开(公告)日:2019-10-03
申请号:US16442412
申请日:2019-06-14
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
Abstract: A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emiting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.
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公开(公告)号:US20190027659A1
公开(公告)日:2019-01-24
申请号:US16039197
申请日:2018-07-18
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
CPC classification number: H01L33/54 , G02B6/0051 , G02B6/0073 , H01L25/0753 , H01L33/10 , H01L33/44 , H01L33/50 , H01L33/507
Abstract: A light-emitting device includes: a base member having a conductive pattern; a light-emitting element arranged on the base member so as to be electrically connected to the conductive pattern; and a dielectric multi-layer film located on an upper surface of the light-emitting element. The dielectric multi-layer film has a first spectral reflectivity in an emission peak wavelength region of the light-emitting element and a second spectral reflectivity in a region that is located at a longer wavelength side of the emission peak wavelength region by 50 nm, and the second spectral reflectivity is greater by 10% or more than the first spectral reflectivity.
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公开(公告)号:US20170122529A1
公开(公告)日:2017-05-04
申请号:US15340990
申请日:2016-11-02
Applicant: NICHIA CORPORATION
Inventor: Motokazu YAMADA
CPC classification number: F21V13/14 , F21V3/00 , F21V3/10 , F21V3/12 , F21V5/04 , F21V7/0083 , F21V7/22 , F21V9/08 , F21V9/30 , F21V15/01 , F21V19/005 , F21Y2113/13 , F21Y2115/10
Abstract: A light emitting device includes a base having a light reflecting surface and having a first side on which the light reflecting surface is provided, light sources mounted on the first side, and a half mirror disposed opposite to the base to reflect a part of incident light and to transmit another part of the incident light. Each of the light sources includes a reflecting layer on an upper surface of each of the light sources. The half mirror has an oblique reflectance with respect to wavelengths of light emitted from the light sources in a case where the light travels obliquely toward the half mirror. The half mirror has a perpendicular reflectance with respect to the wavelengths in a case where the light travels perpendicularly toward the half mirror. The oblique reflectance is smaller than the perpendicular reflectance.
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