Invention Application
US20160204032A1 METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMICONDUCTOR CHIP
有权
将复合材料分成半导体芯片和半导体芯片的方法
- Patent Title: METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMICONDUCTOR CHIP
- Patent Title (中): 将复合材料分成半导体芯片和半导体芯片的方法
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Application No.: US14911024Application Date: 2014-07-30
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Publication No.: US20160204032A1Publication Date: 2016-07-14
- Inventor: Mathias KAEMPF
- Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
- Priority: DE102013108583.0 20130808
- International Application: PCT/EP2014/066398 WO 20140730
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L33/00 ; H01L21/268 ; H01L21/683 ; B23K26/38 ; B23K26/40
Abstract:
The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
Public/Granted literature
- US09873166B2 Method for dividing a composite into semiconductor chips, and semiconductor chip Public/Granted day:2018-01-23
Information query
IPC分类:
