Invention Application
- Patent Title: INJECTION MOLDING DIE
- Patent Title (中): 注射成型模具
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Application No.: US15023467Application Date: 2014-08-18
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Publication No.: US20160207232A1Publication Date: 2016-07-21
- Inventor: Masaomi HASHIMOTO
- Applicant: ENPLAS CORPORATION
- Priority: JP2013-196639 20130924
- International Application: PCT/JP2014/071536 WO 20140818
- Main IPC: B29C45/00
- IPC: B29C45/00 ; B29C45/26 ; B29C45/73 ; B29C45/64 ; B29C45/72 ; B29C45/04 ; B29C45/40

Abstract:
A movable mold includes a movable mold main body and a gear piece attached to the movable mold main body so as to relatively movable, and having a cavity formation space for forming a cavity. In the gear piece, a piece-side coolant flow path includes an annular flow path surrounding the cavity formation space, a piece-side supply flow path introducing coolant into the annular flow path, and a piece-side discharge flow path introducing the coolant from the annular flow path. The piece-side coolant flow path is connected to a movable mold main body-side supply flow path of the movable mold main body and a movable mold main body-side discharge flow path of the movable mold main body and the coolant flows therein under negative pressure generated by a coolant circulation device, so the inside of the cavity can be cooled effectively.
Public/Granted literature
- US10011059B2 Injection molding die Public/Granted day:2018-07-03
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